CMP0029-3D

/CMP0029-3D

CMP0029-3D

3D printed electronics enclosure in Nylon PA12 made in Multi Jet Fusion technology.

Finished with matt black liquid conductive coating.

At the base there is an articulated element with a threaded ring nut for adjusting the inclination.

On the front there is a polyester graphic overlay made with digital printing.

MCS supervised and carried out the entire development of the enclosure, starting from the analysis of the dimensions of the electronics, the components and the area of application of the object.

The design of the product and in the mechanical functions of the jointed base express the maximum potential obtainable with additive manufacturing technologies.

Recommended process for extremely accurate aesthetic needs, with average batches of 25-50-100 pieces.

Approximately size: 180x55xH100mm

Description

3D printed electronics enclosure in Nylon PA12 made in Multi Jet Fusion technology.

Finished with matt black liquid conductive coating.

At the base there is an articulated element with a threaded ring nut for adjusting the inclination.

On the front there is a polyester graphic overlay made with digital printing.

MCS supervised and carried out the entire development of the enclosure, starting from the analysis of the dimensions of the electronics, the components and the area of application of the object.

The design of the product and in the mechanical functions of the jointed base express the maximum potential obtainable with additive manufacturing technologies.

Recommended process for extremely accurate aesthetic needs, with average batches of 25-50-100 pieces.

Approximately size: 180x55xH100mm